RF Sputterer

Description

The RF sputterer was designed to deposit metals and metal-oxide thin-films in a relatively clean (~ micro Torr base pressure) environment. The RF sputterer is a versatile tool that can deposit a range of materials, since it is configured for reactive or nonreactive mode operation. Reactive sputtering refers to the formation of a compound that is different from the target material. Since this system uses metallic targets to form oxides, a reactive deposition requires the flow of oxygen during deposition. 

The system is constructed from stocked components from various vendors, e.g. Kurt J. Lesker, McMaster-Carr.

System Overview

Some photos of the system are given below.

Example: Complete system

Example: Plasma glow

Note: Image taken before anode was installed.

Example: Zinc Target

2" wide, 0.125" thick

Example: Target Housing

The target housing shown here is lowered for changing target materials.